High Temperature Masking Liquid(Adhesive)
Product Description:
Specially formulated (non silicon) hybrid hot melt adhesive possessing excellent high temperature resistance and low slumping characteristics It is specifically formulated to remove easily and cleanly from various substrates used in PCB and handheld electronics Provides excellent chemical resistance and High temperature up to 260 degC It has low outgassing and silicone free A RoHS Compliant and halogen free.
Product Description:
Specially formulated (non silicon) hybrid hot melt adhesive possessing excellent high temperature resistance and low slumping characteristics It is specifically formulated to remove easily and cleanly from various substrates used in PCB and handheld electronics Provides excellent chemical resistance and High temperature up to 260 degC It has low outgassing and silicone free A RoHS Compliant and halogen free.
Application:
Fast dispensing and excellent conformability to PCBA components and gap filling of any damping properties for portable devices against drop/impact resistance It is also typically used for board masking, chemical protection and plating applications for electronics devices